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倒装结构芯片

倒装D结构系列（蓝光）12.6*31.5mil

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倒装D结构系列（蓝光）12.6*31.5mil

尺　　寸：12.6*31.5mil 
产品波段：447.5-457.5nm
使用电流：150mA~300mA
主要应用：COB

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