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Wafer and chip How many chips are cut into a wafer
The relationship between wafer and chip
Chip is composed of a number of semiconductor devices, semiconductors are generally diode, transistor, field effect tube, low power resistance, inductance, capacitance and so on.
A doping technique is used on the substrate to change the concentration of free (electrons) or (holes) in the intrinsic semiconductor to obtain an N or P region. Silicon, germanium, are commonly used semiconductor materials and their properties and materials are easy to obtain in large quantities and at low cost N-type or P-type doping.
A wafer consists of a large number of chips, which are etched onto a single silicon wafer according to the circuit designed by the chip designer. These chips are removed and packaged to form the IC chip
How many chips are on a wafer
This is determined by the chip size and wafer size and yield
At present, the so-called 6 ", 8 ", 12 "or 18" wafers in the industry are actually short for wafer diameter (most of Jiangsu Runshi's products are made of 8 "wafers), but this inch is the estimated value. The actual wafer diameter is 100mm, 150mm, 300mm, and 12 inch is about 300mm, so it's called 12 inch wafer for convenience.
The above formula gives a formula for the number of finished chips that can be cut from each wafer
So this is going to test your computing skills
Assuming A 12-INCH WAFER COSTS $5000 PER CHIP, NVIDIA'S LATEST GT200 CHIP IS 576 SQUARE MILLIMETERS IN SIZE. At A 95% YIELD, WHAT IS THE AVERAGE COST PER CHIP?
Answer: USD 87.72
Wafer fabrication cycle
About the Wafer
The wafer, or wafer, is made of pure silicon (Si). It was generally divided into 6 inches, 8 inches and 12 inches, and the wafers were produced based on this wafer. A small piece on the Wafer, a chip, the scientific name of die, is encapsulated and becomes an IC. A wafer containing NAND Flash wafer is first cut and then tested. The intact, stable and full capacity die is removed and encapsulated to form the NAND Flash chip seen in daily life. Then, the rest on the wafer was either unstable, partially damaged or completely damaged die. Considering the quality assurance, the original factory will declare this die dead, strictly defined as all scrap disposal.
Chip is composed of a number of semiconductor devices, semiconductors are generally diode, transistor, field effect tube, low power resistance, inductance, capacitance and so on.
A doping technique is used on the substrate to change the concentration of free (electrons) or (holes) in the intrinsic semiconductor to obtain an N or P region. Silicon, germanium, are commonly used semiconductor materials and their properties and materials are easy to obtain in large quantities and at low cost N-type or P-type doping.
A wafer consists of a large number of chips, which are etched onto a single silicon wafer according to the circuit designed by the chip designer. These chips are removed and packaged to form the IC chip
How many chips are on a wafer
This is determined by the chip size and wafer size and yield
At present, the so-called 6 ", 8 ", 12 "or 18" wafers in the industry are actually short for wafer diameter (most of Jiangsu Runshi's products are made of 8 "wafers), but this inch is the estimated value. The actual wafer diameter is 100mm, 150mm, 300mm, and 12 inch is about 300mm, so it's called 12 inch wafer for convenience.
The above formula gives a formula for the number of finished chips that can be cut from each wafer
So this is going to test your computing skills
Assuming A 12-INCH WAFER COSTS $5000 PER CHIP, NVIDIA'S LATEST GT200 CHIP IS 576 SQUARE MILLIMETERS IN SIZE. At A 95% YIELD, WHAT IS THE AVERAGE COST PER CHIP?
Answer: USD 87.72
Wafer fabrication cycle
About the Wafer
The wafer, or wafer, is made of pure silicon (Si). It was generally divided into 6 inches, 8 inches and 12 inches, and the wafers were produced based on this wafer. A small piece on the Wafer, a chip, the scientific name of die, is encapsulated and becomes an IC. A wafer containing NAND Flash wafer is first cut and then tested. The intact, stable and full capacity die is removed and encapsulated to form the NAND Flash chip seen in daily life. Then, the rest on the wafer was either unstable, partially damaged or completely damaged die. Considering the quality assurance, the original factory will declare this die dead, strictly defined as all scrap disposal.
